SMCG-HR Series Transient Voltage Suppression Diode

The SMCG-HR series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

•High-Reliability upscreened for critical applications require higher reliability performance and low infant mortality failures. 100% screen and group B test sorting

• 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%

• L bend lead forming gives best solderbility for Hi reliability application

• For surface mounted applications to optimize board space

• Excellent clamping capability

• Typical failure mode is short from over-specified voltage or current

• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

• IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

• ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)

• EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)

• Fast response time: typically less than 1.0ps from 0V to BV min

• Low incremental surge resistance

• Typical IR less than 1μA above 12V

• Built-in strain relief

• Glass passivated chip junction

• High temperature soldering guaranteed: 260°C/10 seconds at terminals

• Meet MSL level1, per J-STD-020, LF maximum peak of 260°C

• Matte tin lead–free plated

• Halogen free and RoHS compliant

• 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01

• VBR @TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)

TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications.

Features: •High-Reliability upscreened for critical applications require higher reliability performance and low infant mortality failures. 100% screen and group B test sorting. • 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%. • L bend lead forming gives best solderbility for Hi reliability application. • For surface mounted applications to optimize board space. • Excellent clamping capability. • Typical failure mode is short from over-specified voltage or current. • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c. • IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact). • ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2). • EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4). • Fast response time: typically less than 1.0ps from 0V to BV min. • Low incremental surge resistance. • Typical IR less than 1μA above 12V. • Built-in strain relief. • Glass passivated chip junction. • High temperature soldering guaranteed: 260°C/10 seconds at terminals. • Meet MSL level1, per J-STD-020, LF maximum peak of 260°C. • Matte tin lead–free plated. • Halogen free and RoHS compliant. • 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01. • VBR @TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)